CVE-2016-2063
Last modified
CVE-2016-2063 is a high-severity vulnerability rated 7.8/10 on the CVSS scale. Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.. EPSS estimates a 0.46% chance of exploitation in the next 30 days.
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Metrics
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness Enumeration
Affected Software
| Vendor | Product | Versions |
|---|---|---|
| Linux | Linux Kernel | >= 3.0, <= 3.19.8 |
References
- http://www.securityfocus.com/bid/92381Third Party Advisory, VDB Entry
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4Mailing List, Patch, Third Party Advisory
- http://www.securityfocus.com/bid/92381Third Party Advisory, VDB Entry
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4Mailing List, Patch, Third Party Advisory
Timeline
- Published
- Last Modified
- Status
- Modified
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