CVE-2017-18145
Last modified
CVE-2017-18145 is a vulnerability of currently unknown severity. In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur.. EPSS estimates a 1.25% chance of exploitation in the next 30 days.
Description
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur.
Metrics
Weakness Enumeration
Affected Software
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm | Msm8909w Firmware | All versions |
| Qualcomm | Sd 210 Firmware | All versions |
| Qualcomm | Sd 212 Firmware | All versions |
| Qualcomm | Sd 205 Firmware | All versions |
| Qualcomm | Sd 450 Firmware | All versions |
| Qualcomm | Sd 615 Firmware | All versions |
| Qualcomm | Sd 616 Firmware | All versions |
| Qualcomm | Sd 415 Firmware | All versions |
| Qualcomm | Sd 625 Firmware | All versions |
| Qualcomm | Sd 650 Firmware | All versions |
| Qualcomm | Sd 652 Firmware | All versions |
| Qualcomm | Sd 820 Firmware | All versions |
| Qualcomm | Sd 835 Firmware | All versions |
| Qualcomm | Sd 845 Firmware | All versions |
References
- http://www.securityfocus.com/bid/103671Third Party Advisory, VDB Entry
- https://source.android.com/security/bulletin/2018-04-01Vendor Advisory
- http://www.securityfocus.com/bid/103671Third Party Advisory, VDB Entry
- https://source.android.com/security/bulletin/2018-04-01Vendor Advisory
Timeline
- Published
- Last Modified
- Status
- Modified
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