CVE-2022-27470
HIGHCVSS 7.8/10EPSS 0.94%
Last modified
CVE-2022-27470 is a high-severity vulnerability rated 7.8/10 on the CVSS scale. SDL_ttf v2.0.18 and below was discovered to contain an arbitrary memory write via the function TTF_RenderText_Solid(). This vulnerability is triggered via a crafted TTF file.. EPSS estimates a 0.94% chance of exploitation in the next 30 days.
Description
SDL_ttf v2.0.18 and below was discovered to contain an arbitrary memory write via the function TTF_RenderText_Solid(). This vulnerability is triggered via a crafted TTF file.
Metrics
CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H
Weakness Enumeration
Affected Software
| Vendor | Product | Versions |
|---|---|---|
| Libsdl | Sdl Ttf | <= 2.0.18 |
| Fedoraproject | Fedora | 34 |
| Fedoraproject | Fedora | 35 |
| Fedoraproject | Fedora | 36 |
References
- https://github.com/libsdl-org/SDL_ttf/commit/db1b41ab8bde6723c24b866e466cad78c2fa0448Patch, Third Party Advisory
- https://github.com/libsdl-org/SDL_ttf/issues/187Exploit, Issue Tracking, Patch, Third Party Advisory
- https://github.com/libsdl-org/SDL_ttf/commit/db1b41ab8bde6723c24b866e466cad78c2fa0448Patch, Third Party Advisory
- https://github.com/libsdl-org/SDL_ttf/issues/187Exploit, Issue Tracking, Patch, Third Party Advisory
Timeline
- Published
- Last Modified
- Status
- Modified
Frequently Asked Questions
What is CVE-2022-27470?
SDL_ttf v2.0.18 and below was discovered to contain an arbitrary memory write via the function TTF_RenderText_Solid(). This vulnerability is triggered via a crafted TTF file.
How severe is CVE-2022-27470?
CVE-2022-27470 has a CVSS score of 7.8/10 (HIGH severity). The EPSS model estimates a 0.94% probability of exploitation in the next 30 days.
How do I fix CVE-2022-27470?
Check the vendor references and advisories linked above for patched versions and mitigation guidance. You can also run a Strix scan to test if your systems are affected.
Are you affected by CVE-2022-27470?
Run a free Strix scan to check your systems for this vulnerability.
Scan your code nowSource: NVD / NIST
